TLWA1100(t11) 2002-07-15 1 toshiba led lamps TLWA1100(t11) panel circuit indicator ? surface-mount devices ? 3.2 (l) 2.8 (w) 1.9 (h) mm ? uv led chip + rgb phosphor ? colors: white ? topr / tstg = -40 to 100c ? reflow soldering possible ? applications: automotive use, backlighting etc. ? standard embossed tape packing: t11 (2000/reel) 8-mm tape reel color and material maximum ratings (ta = = = = 25c) ? ? ? ? characteristics symbol rating unit forward current i f 30 ma power dissipation p d 126 mw operating temperature t opr ? 40~100 c storage temperature t stg ? 40~100 c electrical characteristics (ta = = = = 25c) characteristics symbol test condition min. typ. max. unit forward current v f i f = 20 ma ? 3.5 4.2 v reverse voltage v r i r = 10 ma ? 0.75 ? v unit: mm jedec D jeita D toshiba D weight: 0.035 g (typ.) product name color material TLWA1100 white ingan ? ? ? ?
TLWA1100(t11) 2002-07-15 2 optical characteristics (ta = = = = 25c) characteristics symbol test condition min. typ. max. unit c x i f = 20 ma (note 1) ? chromaticity c y i f = 20 ma (note1) ? luminous intensity i v i f = 20 ma 63 100 ? mcd note 1: the product is tested at the following chromaticity coordinate groups. note 2: ultraviolet light luminescence this white led lamp also emits some uv light. (around 360~400nm) when this led lamp is used for general indicator, it is no problem. however the led is not recommended for the following applications. (1) prohibition - human eye is damaged by the condensed light. (ex. microscope, outer lens, etc) (2) notice - led is located at near a skin (the distance is less than 20mm), and exposure time is more than 120 min. - photosensitive material is used with this led in a set. it might be damaged by the light. note 3: do not break, cut or pulverize the product. c y c x 0.25 0.29 0.30 0.31 0.37 0.32 0.33 0.34 0.35 0.36 0.39 0.37 0.35 0.33 0.31 0.29 0.27 c1 accuracy: 0.01 c2 d1 d2 e1 e2
TLWA1100(t11) 2002-07-15 3 TLWA1100 relative intensity i v /i v (20 ma) ambient temperature ta (c) i f ? ta allowable forward current i f (ma) forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) c x , c y ? i f chromaticity c x , c y forward current i f (ma) i v /i v (20 ma) ? i f 0 0 20 40 60 80 100 120 5 10 15 20 25 30 35 1 2.8 3.0 3.2 3.4 3.6 3.8 4.0 3 10 30 100 ta = 25c 0.28 0 10 20 30 40 50 0.3 0.32 0.34 0.36 0.38 c x c y ta = 25c : reference 0.01 1 300 30 100 3 10 0.03 0.1 0.3 1 3 5 50 500 ta = 25c ambient temperature ta (c) i v ? ta ambient temperature ta (c) c x , c y ? ta chromaticity c x , c y ? 20 0 20 40 80 100 60 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0.32 0.26 ? 20 0 20 40 80 100 60 0.28 0.3 0.34 0.36 c x c y
TLWA1100(t11) 2002-07-15 4 ta = 25c radiation pattern relative intensity wavelength (nm) wavelength characteristic 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 0 300 400 500 600 700 800 0.2 0.4 0.6 0.8 1.0
TLWA1100(t11) 2002-07-15 5 packaging these led devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. the optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. this moisture proof bag may be stored unopened within 12 months at the following conditions. temperature: 5 c~30 c humidity: 90% (max) 2. after opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5c to 30c/60% rh or below. 3. if upon opening, the moisture indicator card shows humidity 30% or above (color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. after baking, use the baked devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 12 to 24 hours. expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. if the packing material of laminate would be broken, the hermeticity would deteriorate. therefore, do not throw or drop the packed devices. mounting method soldering ? reflow soldering ? please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. ? second reflow soldering in case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 c, 60% rh max ? make any necessary soldering corrections manually. (only once at each soldering point) soldering iron : 25 w temperature : 300 c or less time : within 3 s recommended soldering pattern 60~120 s 10 s max 240 c max 4 c/s max 140~160 c 4 c/s max time (s) package surface temperature ( c) temperature profile 1.65 1.15 2.41 unit: mm 1.65
TLWA1100(t11) 2002-07-15 6 cleaning when cleaning is required after soldering, toshiba recommends the following conditions: cleaning solvents : ak225 or alcohol temperature : 50 c (max) for 30 s (max) or 30 c (max) for 3 min (max) ultrasonic : 300 w max precautions when mounting do not apply force to the plastic part of the led under high-temperature conditions. to avoid damaging the led plastic, do not apply friction using a hard material. when installing the pcb in a product, ensure that the device does not come into contact with other cmponents. tape specifications 1. product number format the type of package used for shipment is denoted by a symbol suffix after the product number. the method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard toshiba specifications) (1) tape type: t11 (4-mm pitch) (2) example 2. tape dimensions unit: mm symbol dimension tolerance symbol dimension tolerance d 1.5 + 0.1/ ? 0 p 2 2.0 0.05 e 1.75 0.1 w 8.0 0.3 p 0 4.0 0.1 p 4.0 0.1 t 0.3 0.05 a 0 2.9 0.1 f 3.5 0.05 b 0 3.7 0.1 d 1 1.5 0.1 k 0 2.3 0.1 TLWA1100 (t11) tape type toshiba product no. a 0 p d 1 f e w polarity t k 0 b 0 d p 2 p 0
TLWA1100(t11) 2002-07-15 7 3. reel dimensions unit: mm 4. leader and trailer sections of tape note1: empty trailer section note2: empty leader section 9 0.3 180 + 0 ? 4 60 13 11.4 1.0 2 0.5 44 (note 1) leading part: 190 mm (min) 40 mm or more (note 2) 40 mm or more
TLWA1100(t11) 2002-07-15 8 5. packing display (1) packing quantity reel 2,000 pcs carton 10,000 pcs (2) packing form: each reel is sealed in an aluminum pack with silica gel. 6. label format (1) example: TLWA1100 (t11) p/n: type TLWA1100 add.c (t11) q?ty 2,000 pcs note lot number (rank symbol) seal date: (2) label location tape feel direction label position label position ? reel ? carton ? the aluminum package in which the reel is supplied also has the label attached to center of one side.
TLWA1100(t11) 2002-07-15 9 ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc.. ? the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others. ? the information contained herein is subject to change without notice. 000707eac restrictions on product use
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